BUCKLING BEAM
Micro-Wire substrate
H3C 1.0 mil probes; 60um pitch; Multi-site configuration.
Ease of pin replacement at your test site – minimize production line down
US Patent #: 9,933,479 B2 | US Patent #: 10,096,958 B2
US Patent #: 9,933,479 B2 | US Patent #: 10,096,958 B2
