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Vertical Probe Card

Spire Manufacturing is proud to introduce our high-quality, vertical probing solution to wafer testing for memory, microprocessors, and logic devices. With our vertical technology, our customers can increase test yields while reducing test time and operating costs with multi-site testing. The biggest focus in our R&D efforts is in the area of vertical contact technology.

Combining breakthroughs in interconnect technology and precision manufacturing techniques, our vertical probe cards can provide a number of performance benefits that are unattainable in the conventional cantilever probe cards. Precision manufactured parts guarantee reliable and repeatable contact for optimal performance. Our engineering team is confident that we can provide a high-quality, cost effective vertical solution that will meet our customers' specifications.

93k Direct Dock Vertical Probe Card Solution Custom MLO/MLC substrate design & mfg. RF or High current vertical pogo probe card

GENERAL SPECIFICATIONS Material Paliney7, BeCu, H3C Tip Style Flat, Pointed, Wedge Maximum Probes > 5,000 Temperature Range Ambient to 150°C MECHANICAL SPECIFICATIONS Probe Diameters 4 mils 3 mils 2 mils Min. Pad Pitch-Linear 170 µm 135 µm 100 µm Min. Pad Pitch-Array 180 µm 150 µm 120 µm Balanced Contact Force 3.5 g/mils 2.5 g/mils 1.2-2.0 g/mils Planarity < 40 µm < 40 µm < 40 µm Alignment ±12.5 µm ±12.5 µm ±12.5 µm ELECTRICAL SPECIFICATIONS Leakage < 10 nA @5V