Load Boards
Spire Manufacturing offers design and fabrication services to cover load boards / interface boards. Our design allows test and measurement of the Device Under Test (DUT) without distortion, noise, delays, nor errors to the testing process of the DUT. Our design engineers are experienced in providing robust design solutions. The key areas are in power supply routing, signal routing, connectors and components to ensure good signal fidelity as well as mechanical performance. Most designs, fabrications and assemblies can be completed in 5 to 7 weeks.
Design
Experience allows us to minimize costs using design for manufacturability practices
Our designers work on boards with:
• Digital
• Analog
• Mixed Signals
• RF signals
• High Power circuits
• High Speed lines
Tester Library
| Advantest | Agilent | Teradyne | Credence | NPtest | LTX |
| 6672 | 83000 | J971/J973 | LT1101/SC312 | ITS9000 KX IX EXA |
Fusion HF |
| 6673 | 84000 | J750 | Kalos | EXA3000 512 1024 | Fusion CF |
| 93000 | Catalyst | DUO/Quartet | IDS5000 | ||
| 9394/94000 | Tiger | Octet | IDS10000 | ||
| NP2500 | Flex | Sapphire | Sentry | ||
| Pinscale | UltraFlex | Diamond | 15/20/21/50 | ||
| 3600 | ASL3000 | ||||
| IMS |
Fabrication Capabilities
Getek, FR-4 Epoxy, Polyimide, Teflon, Rogers, Nelco
Holes Aspect Ratio of >15:1
NPT Hole Tolerance +/- 0.001
Hole to Hole Location Accuracy +/- 0.001
Maximum Thickness: .250"
Matched Impedance +/- 5%
Minimum Dielectric Space Cores: .003" - .004"
Layers count - 36 to 52 layers
Material – FR4 / Gore (Speed board C)/Teflon: Rogers
Minimum Drilling hole size - 0.006"
Maximum Aspect ratio - 20:1 to 25:1
Minimum Pitch - 0.40mm
Product Sectors
Digital
High Speed, LVDS Mixed Signal
Power, LAN, A-D, Graphics Memory
DDR, Rambus RF
Radio frequency
Package Types
PLCC
TQFP
SOIC
TSSOP
BGA 1.27mm, 1.00mm, .8mm, .5mm, .4mm
If you are interested in learning more of our services & support, please contact your Spire Manufacturing sales representative.
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