Spire Manufacturing specializes in Cantilever probe cards for wafer probing. We design and manufacture quality probe cards that are robust and cost-effective. Our cantilever supports various applications from fine pitch, parametric testing, high temperature and radio frequency. Our design engineers are experienced and go through analysis and simulation in ensuring uniformity for each product line. Spire Manufacturing has the most state of the art equipment and proprietary techniques to design and manufacture high-end Cantilever Probe Cards.
Standard Probe Card; Shelf Probe Card; Pad and Bump Probe Card and High temperature probe card
RF Probe Card up to 3 GHz and up to 2,500 probes
Custom design features to meet extreme temperature wafer level probing.
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Zero Scrub
Spire Manufacturing engineering team have a solution for extreme temperature testing conditions, custom design features to meet our customer's wafer level probing.
Custom design features to meet extreme temperature wafer level probing.
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Parametric low leakage
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High performance low leakage PCB material. Meet or exceed Agilent 4070 series test specifications
Agilent: 4062/4070/4080 Series
Keithley: S600/S630 Series
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For more advanced cantilever technology and learning more of our services & support click here for more information.